Functional Filler Composites
Our unique compounding technology enables us to add inorganic fillers or adhesive properties for metals to hydrocarbon resins, which had been difficult to achieve. A representative application is functional filler for electrical and electronic component sealing. Its properties of high filler content, low viscosity, and high heat resistance are shown in the following table.
TELENE®1800 Series’s Properties (as sealant)
Its low viscosity and adhesiveness make it possible to achieve high filler content and add functionalities to resins. The following table shows basic properties of neat resins and a functional filler compound.
TELENE®1800 Series with Higher Heat Resistance
Physical and thermal properties of TELEN1800 series and epoxy resins
